Opportunity Expired
Interface across various work areas and organizations to help with the design, development and analysis of different semiconductor packaging technologies to enable differentiation for TI’s analog and embedded processing products. TI’s innovative packaging technologies are designed to solve customers’ problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power. In this role you’ll get the opportunity to thrive in a fast paced, dynamic environment where high-energy, prioritization skills and adaptability are a must!
Packaging engineers play an important role at TI which encompasses the following responsibilities
The opportunity is available to applicants in any of the following categories.
Malaysia
Malaysian Temporary Work Visa
Malaysian Citizen
Malaysian Permanent Resident