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Texas Instruments Malaysia

  • 1,000 - 50,000 employees

Packaging Engineer null

Malacca city

Opportunity Expired

Texas Instrument Malaysia is hiring for the role of Packaging Engineer

Opportunity details

Opportunity Type
Graduate Job

Application dates

Minimum requirements

Accepting International Applications
No
Qualifications Accepted
E
Aerospace Engineering & Aviation
Automotive & Transport Engineering
Chemical Engineering
Civil Engineering & Construction
Communications Engineering
Electrical & Electronic Engineering
Engineering Management
Environmental Engineering
Fire & Safety Engineering
Geomatic Engineering
Manufacturing Engineering
Marine Engineering
Materials Engineering
Mathematics & Statistics
Mechanical Engineering
Mining Engineering
Petroleum Engineering
Renewable Energy Engineering
Robotics & Mechatronics Engineering
Engineering & Mathematics (all other)
Geotechnical Engineering
Biomedical Engineering

Hiring criteria

Entry Pathway

See details

Working rights

Malaysia

  • Malaysian Temporary Work Visa
  • Malaysian Citizen
  • Malaysian Permanent Resident
Read more

About the job

Interface across various work areas and organizations to help with the design, development and analysis of different semiconductor packaging technologies to enable differentiation for TI’s analog and embedded processing products. TI’s innovative packaging technologies are designed to solve customers’ problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power. In this role you’ll get the opportunity to thrive in a fast paced, dynamic environment where high-energy, prioritization skills and adaptability are a must!

Packaging engineers play an important role at TI which encompasses the following responsibilities

  • Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wire bond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness
  • Participate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage
  • Direct design-of-experiments and work with material suppliers to down select innovative packaging materials to enhance the reliability and performance of advanced packages.
  • Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs.

Minimum requirements

  • Bachelor's degree in Material Science, Mechanical Engineering, Chemical Engineering, Polymer Science or Physics, Electrical Engineering
  • Minimum Cumulative 3.0/4.0 GPA, or higher
  • Open to fresh graduates and experienced professionals in the semiconductor process

Preferred qualifications

  • Basic understanding of statistical process control (SPC)
  • Semiconductor packaging knowledge is preferred (manufacturing processes, assembly, reliability, materials, characterization, FA)
  • Demonstrated analytical and problem solving skills
  • Strong written and verbal communication skills
  • Ability to work in teams and collaborate effectively with people in different functions
  • Strong time management skills that enable on-time project delivery
  • Ability to build strong, influential relationships
  • Ability to work effectively in a fast-paced and rapidly changing environment
  • Ability to take the initiative and drive for results

Hiring criteria

You should have or be completing the following to apply for this opportunity.

Entry Pathway
Degree or Certificate
Minimum Level of Study
Bachelor or higher
Study Field
E
Aerospace Engineering & Aviation
Automotive & Transport Engineering
Biomedical Engineering
Chemical Engineering
Civil Engineering & Construction
Communications Engineering

Work rights

The opportunity is available to applicants in any of the following categories.

country
eligibility

Malaysia

Malaysia

Malaysian Temporary Work Visa

Malaysian Citizen

Malaysian Permanent Resident